High-Lumen COB LED Display Module

High Resolution and Pixel Density:

By packing LED chips directly onto a circuit board, COB technology allows for extremely tight pixel spacing, resulting in a significantly higher pixel density. This translates to clearer, more detailed, and more vivid images, making them ideal for high-definition content.

Improved Light Quality:

COB displays create a surface light source rather than discrete point sources, which eliminates graininess and reduces more patterns. This uniform light also provides more consistent color and brightness, even from an angle.

Wider Viewing Angles:

The diffused and uniform light source improves viewing angles and reduces glare, ensuring that colors remain consistent and vibrant when viewed from various positions.

Increased Durability and Resilience

Robust Protection:

LED chips are embedded and cured with a protective resin, creating a smooth, hard surface that is resistant to dust, moisture, impacts, and static electricity.

Effective Heat Dissipation:

With the chips soldered directly to the board and heat dissipated through the substrate, COB technology offers superior heat dissipation compared to traditional methods, leading to increased reliability and a longer lifespan for the display.

Higher Energy Efficiency:

By emitting light directly from the chip and reducing light loss, COB displays can achieve higher brightness and luminous efficiency with less power consumption, aligning with green energy-saving requirements.

Thinner and Lighter Design:

The integration of chips onto the board allows for a more compact design, resulting in thinner and lighter modules, which is beneficial in space-limited applications.

Module and Flexible Options:

COB technology can be adapted to create flexible displays that maintain consistent image quality and smooth transitions even when curved, as noted in various guides.