Solder paste printing

The manufacturing of LED display modules at Fujian Hoozoe involves a precisely controlled, technology-driven workflow.

The process begins with PCB preparation and proceeds through assembly, with each phase ensuring functional integrity and quality. A crucial stage is the application of solder paste to the integrated circuit (IC) pads on the PCB. This paste, composed of fine solder alloy and flux, is deposited using a computer-controlled stencil printer to achieve exacting coverage and positional accuracy.

This precisely applied paste performs two essential roles: it mechanically holds surface-mount components in place and creates the preliminary electrical interconnections that are subsequently permanentized during the reflow soldering operation.