LED Packaging

Following component placement, the LED chips undergo a precision packaging process. This involves using automated die bonders and wire bonders to accurately mount and electrically connect each microscopic LED chip onto the substrate. The chips are then protected by a uniform layer of optically clear encapsulation material, typically applied by precise dispensing or molding equipment.

This encapsulation is critical as it hermetically seals the sensitive LED chips, safeguarding them from physical damage, moisture, and contaminants. The process ensures long-term stability, consistent color performance, and optimal light output for the display module.